01HOW WE WORK
Design services plus tape-out success.
Priced like ARM. Structured like a design house.
— Base fee on signing.— Success fee on tape-out.— Royalty on volume.
02STRUCTURE
Three components. One outcome.
BASE FEE
Retained engagement.
Team, tools, delivery.
SUCCESS FEE
Tied to outcome.
Paid at first-pass tape-out.
ROYALTY
Paid at scale.
On shipped volume.
03TIMELINE
From first call to first silicon.
WEEK 0Scope
WEEK 2Kickoff
WEEK 8RTL + DV
WEEK 20Netlist
WEEK 36Tape-out
Pilot module: 6–8 weeks. Full SoC: 9–12 months. Derivative: a fraction of either.
04SCOPE
Clear boundaries. No surprises.
You provide
- Spec.
- PPA targets.
- Foundry access.
- A technical counterpart.
We deliver
- RTL, DV closure, netlist, GDS.
- Design memos at each milestone.
- 90 days of post-silicon bring-up.
05IP
Your IP stays yours.
01
Design IP transfers to you at tape-out. Full ownership.
02
Your data never leaves your boundary. On-prem available.
03
Agent improvements stay with us. Your design patterns do not.
06START
Three ways in.
Hiring a chip team takes 18 months. Starting with us takes 2 weeks.